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TA2152FLG
TOSHIBA Bipolar Linear IC Silicon Monolithic
TA2152FLG
Low Current Consumption Headphone Amplifier (for 1.5-V/3-V Use)
The TA2152FLG is a headphone amplifier of low current consumption type developed for portable digital audio. It is especially suitable for portable CD players, portable MD players etc.
Features
* Low current consumption * The power amplifier output stage can be driven using a single battery. As a result, overall current consumption is low.
* *
Built-in center amplifier switch For the output-coupling type, the consumption current has been decreased still further. Current value (VCC1 = 2.4 V, VCC2 = 1.2 V, f = 1 kHz, RL = 16 , Ta = 25C, typ.) * Output-coupling type * * * * * * No Signal: ICC (VCC1) = 0.4 mA, ICC (VCC2) = 0.3 mA 0.1 mW x 2 ch: ICC (VCC1) = 0.5 mA, ICC (VCC2) = 2.2 mA 0.5 mW x 2 ch: ICC (VCC1) = 0.5 mA, ICC (VCC2) = 5.0 mA No Signal: ICC (VCC1) = 0.7 mA, ICC (VCC2) = 0.7 mA 0.1 mW x 2 ch: ICC (VCC1) = 0.7 mA, ICC (VCC2) = 4.5 mA 0.5 mW x 2 ch: ICC (VCC1) = 0.8 mA, ICC (VCC2) = 10.0 mA (VCC1 = 2.4 V, VCC2 = 1.2 V, f = 1 kHz, RL = 16 , THD = 10%, Ta = 25C)
Weight: 0.05 g (typ.) Marking: 2152
* OCL type
* * * * * * *
Output power: Po = 8 mW (typ.) Voltage gain: GV = 11.5dB (typ.) Built-in beep function Built-in low-pass compensation (output-coupling type) Built-in mute switch Built-in power switch Operating supply voltage range (Ta = 25C) VCC1 (opr) = 1.8 V~4.5 V VCC2 (opr) = 0.9 V~4.5 V
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TA2152FLG
Block Diagram (of OCL Application)
VCC1
VCC1
ON OFF PW SW 18 MUTE TC 19 VCC1 VCC1 20
ON OFF MUTE SW 17 BEEP IN 16 BIAS OUT C-AMP SW RF IN 12 BIAS IN 11 OUT ADJ 10
15
14
GND
13
PW/MUTE SW
BEEP
C-AMP SW
BIAS
INB 21
INA 22
NC 9
VCC2 VCC2 23 BEEP OUTA 24
PW A PW C PW B
NC 8 BEEP OUTB 7
1
OUTA
2
EQA
3
PW GND
4
OUTC
5
EQB
6
OUTB
RL
RL
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TA2152FLG
Pin Descriptions Pin Voltage: Typical pin voltage for test circuit when no input signal is applied (VCC1 = 2.4 V, VCC2 = 1.2 V, Ta = 25C)
Pin No. 1 4 6 3 23 Name OUTA 23 OUTC OUTB PW GND VCC2 GND for power drive stage 3 VCC for power drive stage 1.2 Outputs from power amplifier 1 0 VCC2 0.6 Function Internal Circuit Pin Voltage (V)
2
EQA Low-pass compensation pins
20 k
0.6
5
EQB 22 1
21
INB Inputs to power amplifier 5 k 15 k 43 k 2 0.6
22
INA
7
BEEP OUTB Outputs for beep signal
VCC2 24
24
BEEP OUTA GND for everything other than power drive stage Not connected
14 8 9
GND NC NC
VCC2
0
10
OUT ADJ
DC output voltage adjustment Either connect this pin or leave it open depending on the level of VCC2. If the power supply of a 1.5 V system is applied to VCC2, connect this pin to BIAS IN (pin11) If the power supply of a 3 V system is applied to VCC2, leave this pin open. Bias circuit input Ripple filter input Bias circuit output VCC for everything other than power drive stage
47 k 15 k
12
0.6
VCC1 20 0.6
10
11 12 15 20
BIAS IN RF IN BIAS OUT VCC1
11 62 k
15
1.1 0.6 2.4
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TA2152FLG
Pin No. Name Function Internal Circuit Pin Voltage (V)
VCC1
13
C-AMP SW
Center amplifier switch C-Cup type: GND OCL type: Open
13 to center amplifier
16
BEEP IN
Beep signal input If the beep function is not used, this pin is connected to GND.
10 k 16
17
MUTE SW
Mute switch Mute OFF: L level Mute ON: H level Refer to application note (6)
VCC1 62 k 17
VCC1 100 k 18 PW SW 10 k Power switch IC ON: H level IC OFF: L level Refer to application note (6) 18
VCC1
19
MUTE TC
Mute smoothing Reduces pop noises during switching.
19
39 k
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TA2152FLG
Application Notes
(1) Beep function
In Power Mute Mode, the beep signal from the microcomputer or other controlling device is input on the BEEP IN pin (pin 16). This signal is output as a current which flows to the load via the BEEP output pin (pin 7/24). The beep level is set to Vo = -50dBV (RL = 16 (typ.) ). For the beep signal timing, please refer to Figure 1.
ON PW SW OFF ON MUTE SW OFF
BEEP
OUT 100 ms 100 ms 10 ms 100 ms
OCL type
Output-coupling type
200 ms
100 ms
10 ms
100 ms
Figure 1 Timing chart for beep and output signals
(2) Low-cut compensation
For output-coupling type, the low-frequency range can be decreased using an output-coupling capacitor and a load (fc = 45 Hz at C = 220 F, R = 16 ). However, since the capacitor is connected between the IC's output pin (pin 1/6) and EQ pin (pin 2/5), the low-frequency gain of the power amplifier increases, enabling low-cut compensation to be performed. For the response of capacitors of different values, please refer to Figure 2.
RES - f
4
2 0.18 F 0.22 F -2 0.33 F 0.47 F 0.68 F -6 No compensation -8 20 50 100 200 500 1k 2k
Response (dB)
0
-4
Frequency
f (Hz)
Figure 2 Capacitor response
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(3) Adjustment of DC output voltage
Please perform the OUT ADJ pin (pin 10) as follows by the power supply of VCC1 and VCC2. * If a boost voltage is applied to VCC1, VCC2 is connected to a battery and the difference between VCC1 and VCC2 is greater than or equal to 0.7 V, short pins 10 and 11 together. In this case the DC output voltage will be * VCC2 . 2
If the difference between VCC1 and VCC2 is less than 0.7 V, or if VCC1 and VCC2 are connected to the same power supply, leave pin 10 open. In these cases the DC output voltage will be VCC2 - 0.7 V . 2
However, when the voltage level of VCC2 is high, the DC output voltage is will be set to approximately 1.4 V.
(4) RF IN pin
The ripple rejection ratio can by improved by connecting a capacitor to this pin. Connection of a capacitor is recommended, particularly for output-coupling type.
RR - C (RF IN)
30 Output-coupling type
(dB) RR Ripple rejection ratio
40
50
60
70
VCC1 = 2.4 V VCC2 = 1.2 V (ripple signal applied) 80 fr = 100 Hz Vr = -20dBV BIAS IN = 4.7 F Open 0.1 0.2 0.5 1 2 5 10
RF IN capacitance
C
(F)
Figure 3 Improvement of ripple rejection ratio
(5) Output application of power amplifier
For output-coupling type the center amplifier is not used with the result that current consumption is low. Please set the C-AMP SW pin (pin 13) accordingly. Output-coupling type: Pin 13 is connected to GND. OCL type: Pin 13 is open.
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(6) Switching pins
(a) PW SW
The device is ON when this pin is set to High. To prevent the IC being turned ON by external noise, it is necessary to connect an external pull-down resistor to the PW SW pin. The pin is highly sensitive.
(b) MUTE SW
If the MUTE SW pin is fixed to High, current will flow through the pin, even when the PW SW pin is in OFF Mode. To prevent the IC being turned ON by external noise, it is necessary to connect an external pull-down resistor. The pop noise heard when the MUTE SW switch is turned ON or OFF can be reduced by connecting an external capacitor to the MUTE TC pin.
(c) Switch sensitivity (Ta = 25C)
PW SW
5 4.5 V 4 4 5 4.5 V
MUTE SW
(V)
V18
3
V17
(V)
H
3 H
Pin voltage
2 1.5 V 1 0.3 V 0 0 1 2 3
Pin voltage
2
1
1.0 V 0.3 V
L 4 5
0 0
L 2 3 4 5
1
Supply voltage
VCC1
(V)
Supply voltage
VCC1
(V)
PW SW H level L level IC ON IC OFF H level L level
MUTE SW Mute ON Mute OFF
Figure 4 Switch sensitivity
(7) Miscellaneous
The following capacitors must have excellent temperature and frequency characteristics. * Capacitor between VCC1 (pin 20) and GND (pin 14) * Capacitor between VCC2 (pin 23) and PW GND (pin 3) * Capacitor between BIAS IN (pin 11) and GND (pin 14) * Capacitor between BIAS OUT (pin 15) and GND (pin 14) * Capacitor between RF IN (pin 12) and GND (pin 14)
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Absolute Maximum Ratings (Ta = 25C)
Characteristic Supply voltage 1 Supply voltage 2 Output current Power dissipation Operating temperature Storage temperature Symbol VCC1 VCC2 Io (peak) PD (Note) Topr Tstg Rating 4.5 4.5 100 350 -25~75 -55~150 mA mW C C Unit V
Note: Derated by 2.8 mW/C above Ta = 25C
Electrical Characteristics (Unless otherwise specified VCC1 = 2.4 V, VCC2 = 1.2 V, Rg = 600 , RL = 16 , f = 1 kHz, Ta = 25C, SW1: a, SW2: b, SW3: a)
Characteristic Symbol ICCQ1 ICCQ2 ICCQ3 ICCQ4 Quiescent supply current ICCQ5 ICCQ6 ICCQ7 ICCQ8 ICCQ9 ICCQ10 ICC1 Power supply current during drive ICC2 ICC3 ICC4 Voltage gain Channel balance Output power Total harmonic distortion Output noise voltage Cross talk Ripple rejection ratio 1 Ripple rejection ratio 2 Muting attenuation Beep sound output voltage PW SW ON current PW SW OFF voltage Mute SW ON current Mute SW OFF voltage GV CB Po THD Vno CT RR1 RR2 ATT Test conditions IC OFF (VCC1), SW1: b IC OFF (VCC2), SW1: b OCL, Mute ON (VCC1), SW2: a OCL, Mute ON (VCC2), SW2: a C-Cup, Mute ON (VCC1), SW2: a C-Cup, Mute ON (VCC2), SW2: a OCL, no signal (VCC1) OCL, no signal (VCC2) C-Cup, no signal (VCC1) C-Cup, no signal (VCC2) OCL, 0.5 mW x 2 ch (VCC1) OCL, 0.5 mW x 2 ch (VCC2) C-Cup, 0.5 mW x 2 ch (VCC1) C-Cup, 0.5 mW x 2 ch (VCC2) Vo = -22 dBV Vo = -22 dBV THD = 10% Po = 1 mW Rg = 600 , Filter: IHF-A, SW3: b Vo = -22 dBV Inflow to VCC1, SW3: b fr = 100 Hz, Vr = -20 dBV Inflow to VCC2, SW3: b fr = 100 Hz, Vr = -20 dBV Vo = -12 dBV Min 9.5 -1.5 5 -25 -65 -85 -100 -55 5 0 5 0 Typ. 0.1 0.1 400 650 170 85 0.7 0.7 0.4 0.3 0.8 10.0 0.5 5.0 11.5 0 8 0.1 -100 -35 -85 -100 -115 -50 Max 5 5 600 1400 250 170 1.1 1.5 mA 0.6 0.6 13.5 +1.5 1.0 -96 dB -45 0.3 0.3 dBV A V A V dB mW % dBV mA A Unit
VBEEP (OUT) VBEEP (IN) = 2 Vp-p I18 V18 I17 V17 VCC1 = 1.8 V, VCC2 = 0.9 V VCC1 = 1.8 V, VCC2 = 0.9 V VCC1 = 1.8 V, VCC2 = 0.9 V VCC1 = 1.8 V, VCC2 = 0.9 V
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TA2152FLG
Test Circuit
VCC1 VCC1
0.47 F
18 PW SW 19 MUTE TC
17 MUTE SW
16 BEEP IN
10 F 15 BIAS OUT
(a) SW1 (b)
(a) SW2 (b)
14 GND
13 C-AMP SW RF IN 12
4.7 F 22 F VCC1 20 VCC1 BIAS IN 11
600 (b) 10 F BIAS OUT (a) SW3b Rg = 600 600 (b) 10 F (a) SW3a Rg = 600 VCC2 21 INB TA2152FLG 22 INA NC 9 OUT ADJ 10
22 F
23 VCC2
NC 8
24 BEEP OUTA OUTA 1 EQA 2
PW GND 3
BEEP OUTB 7 OUTC 4 EQB 5 OUTB 6
RL 16
RL 16
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TA2152FLG
Characteristic Curves (unless otherwise specified, VCC1 = 2.4 V, VCC2 = 1.2 V, Rg = 600 ,
RL = 16 , f = 1 kHz, Ta = 25C)
ICCQ - VCC2
1.5 1.5
ICCQ - VCC1
(mA)
1.5 V application VCC2 = 1.2 V OCL: VCC2 current 1
(mA)
1.5 V application VCC1 = 2.4 V
ICCQ
1
Quiescent supply current
OCL: VCC1 current OCL: VCC2 current 0.5 C-Cup: VCC1 current
Quiescent supply current
ICCQ
OCL: VCC1 current 0.5 C-Cup: VCC1 current
C-Cup: VCC2 current
C-Cup: VCC2 current
0
0 0 1 1.5 2 2.5 0 1 2 3 4 5
Supply voltage of power drive stage
VCC2
(V)
Supply voltage
VCC1 (V)
ICCQ - VCC
(mA)
VO (DC) - VCC2
1.5
(V)
OCL
1.5 Pin 10, 11: Short 1.5 V application
ICCQ
Quiescent supply current
Output DC voltage
1 C-Cup
VO(DC)
1
Pin 10, 11: Open 3 V application 0.5
0.5 3 V application VCC1 = VCC2 ICCQ (VCC1 + VCC2) 0 0 1 2 3 4 5
0
0
1
2
3
4
5
Supply voltage
VCC (V)
Supply voltage of power drive stage
VCC2
(V)
ICC - Po
100 OCL mode f = 1 kHz Dual input VCC2 100 C-Cup mode f = 1 kHz Dual input
ICC - Po
(mA)
ICC
ICC
10
(mA)
10
VCC2
Supply current
1 VCC1
Supply current
1 VCC1
0.1 0.01
0.1
1
10
100
0.1 0.01
0.1
1
10
100
Output power Po (mW)
Output power Po (mW)
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TA2152FLG
Po - VCC2
30 20 100 3 V application VCC1 = VCC2 50 f = 1 kHz RL = 16 30 20
Po - VCC
(mW)
Po
10
Output power
Output power
Po
1.5 V application VCC1 = 2.4 V f = 1 kHz RL = 16 0 1 1.5 2 2.5
(mW)
5
10
5 3 2 0
3
2
1
2
3
4
5
Supply voltage of power drive stage
VCC2
(V)
Supply voltage
VCC (V)
THD - Vo
100 1.5 V application 100 3 V application
THD - Vo
VCC1 = VCC2 = 2.4 V RL = 16 10
(%)
VCC2 = 1.2 V 10 RL = 16
THD
Total harmonic distortion
1 f = 10 kHz f = 100 Hz 0.1 f = 1 kHz 0.01 -60
Total harmonic distortion
THD
(%)
1
VCC1 = 2.4 V
f = 10 kHz f = 100 Hz 0.1 f = 1 kHz
-50
-40
-30
-20
-10
0
0.01 -60
-50
-40
-30
-20
-10
0
Output voltage
Vo
(dBV)
Output voltage
Vo
(dBV)
Vno - VCC2
-90 -90
Vno - VCC
(dBV)
Vno
-100
OCL
Vno
(dBV)
-100
OCL
Output noise voltage
C-Cup -110 1.5 V application VCC1 = 2.4 V -120 Rg = 600 Filter: IHF-A 0 1 1.5 2 2.5
Output noise voltage
C-Cup -110 3 V application VCC1 = VCC2 -120 Rg = 600 Filter: IHF-A 0 1 2 3 4 5
Supply voltage of power drive stage
VCC2
(V)
Supply voltage
VCC (V)
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TA2152FLG
CT - VCC2
1.5 V application 0 VCC1 = 2.4 V f = 1 kHz 0 3 V application VCC1 = VCC2 f = 1 kHz
CT - VCC
CT (dB)
CT (dB)
OCL
-20
-20
Cross talk
Cross talk
OCL -40
-40
C-Cup -60 -60
C-Cup
0
1
1.5
2
2.5
0
1
2
3
4
5
Supply voltage of power drive stage
VCC2
(V)
Supply voltage
VCC (V)
RR - VCC2
1.5 V application -40 fr = 100 Hz Vr = -20 dBV RR1: Inflow to VCC1 -60 RR2: Inflow to VCC2 RR2 (C-Cup) -40 3 V application fr = 100 Hz Vr = -20 dBV VCC1 = VCC2 -60
RR - VCC
(dB)
RR
Ripple rejection ratio
Ripple rejection ratio
RR
(dB)
C-Cup
-80
RR1 (OCL) RR1 (C-Cup)
-80
-100 RR2 (OCL) 0 1 1.5 2 2.5
-100
OCL
0
1
2
3
4
5
Supply voltage of power drive stage
VCC2
(V)
Supply voltage
VCC (V)
VBEEP (OUT) - VBEEP (IN)
0
(dBV) VBEEP (OUT) Beep output voltage
f = 400 Hz (rectangle wave) -10 R = 16 L -20 -30 -40 -50 -60 -70 -80 -90 -100 0.1 0.3 0.5 1 3 5 10
Beep input voltage
VBEEP (IN)
(Vp-p)
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TA2152FLG
ICCQ - Ta
(mA)
0.8 OCL: VCC2 current 15 VCC1 = 2.4 V VCC2 = 1.2 V
GV, Po, THD - Ta
(%) Total harmonic distortion THD
0.8
0.6
OCL: VCC1 current
Voltage gain GV (dB) Output power Po (mW)
ICCQ
GV 10 Po
0.6
Quiescent supply current
C-Cup: VCC1 current 0.4
0.4
C-Cup: VCC2 current 0.2 VCC1 = 2.4 V VCC2 = 1.2 V 0 -20 0 20 40 60 80
5 0.2 THD
0
-20
0
20
40
60
80
0
Ambient temperature
Ta
(C)
Ambient temperature
Ta
(C)
Vno, VBEEP (OUT) - Ta
Output noise voltage Vno (dBV) Beep output voltage VBEEP (OUT) (dBV)
-40 VCC1 = 2.4 V VCC2 = 1.2 V 0 VCC1 = 2.4 V VCC2 = 1.2 V
CT - Ta
-60
CT (dB)
VBEEP (OUT)
-20 OCL -40
-80
-100
Vno (OCL) Vno (C-Cup)
Cross talk
-60
C-Cup
-120
-20
0
20
40
60
80
-80
-20
0
20
40
60
80
Ambient temperature
Ta
(C)
Ambient temperature
Ta
(C)
RR - Ta
-20 VCC1 = 2.4 V VCC2 = 1.2 V -60 VCC1 = 2.4 V VCC2 = 1.2 V -80
ATT - Ta
(dB)
-40
Vr = -20 dBV RR1: Inflow to VCC1 RR2: Inflow to VCC2 RR2 (C-Cup)
Ripple rejection ratio
Muting attenuation
-60
ATT (dB)
fr = 100 Hz
RR
-100 OCL -120 C-Cup -140
-80
RR1 (OCL) RR1 (C-Cup)
-100 RR2 (OCL) -20 0 20 40 60 80
-20
0
20
40
60
80
Ambient temperature
Ta
(C)
Ambient temperature
Ta
(C)
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TA2152FLG
Application Circuit1 (1.5 V Output Coupling Type)
VCC1
VCC1
OFF PW SW 18 MUTE TC 19 0.47 F VCC1 22 F 20
OFF MUTE SW 17
BEEP IN 16
10 F BIAS OUT
ON
ON
15
14
GND
13
C-AMP SW RF IN 2.2 F 12 BIAS IN 4.7 F 11 OUT ADJ 10 3 V application : Open
PW/MUTE SW
BEEP
C-AMP SW
BIAS
1 F
INB 21
1 F
INA 22
NC 9
VCC2 22 F 23 BEEP OUTA 24
PW A PW C PW B
NC 8 BEEP OUTB 7
1
OUTA
2
EQA
3
PW GND
4
OUTC
5
EQB
6
OUTB 220 F
220 F
0.22 F
0.22 F
RL
RL
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TA2152FLG
Application Circuit2 (1.5 V OCL Type)
VCC1
VCC1
OFF PW SW 18 MUTE TC 19 0.47 F VCC1 20 22 F
OFF MUTE SW 17
BEEP IN 16
10 F BIAS OUT
ON
ON
15
14
GND
13
C-AMP SW RF IN 12 BIAS IN 4.7 F 11 OUT ADJ 10 3 V application : Open
PW/MUTE SW
BEEP
C-AMP SW
BIAS
1 F
INB 21
1 F
INA 22
NC 9
VCC2 22 F 23 BEEP OUTA 24
PW A PW C PW B
NC 8 BEEP OUTB 7
1
OUTA
2
EQA
3
PW GND
4
OUTC
5
EQB
6
OUTB
RL
RL
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TA2152FLG
Markings
Markings (example) *1
*1
9 *2 0 *1 Product name: 2152 *2 Weekly code: 9 0 1 K A Toshiba internal management code Weekly code Year (last digit only) A K 1
Orientation marking *2
Precautions when using QON
Package outline
(Upper surface) (lower surface)
Please take into account the following points regarding the QON package (1) Do not attempt to strengthen the device mechanically by performing soldering on the island sections at the four corners of the package (the sections illustrated by diagonal lines) on the diagram of the lower surface. This island sections on the package surfaces (the sections illustrated by diagonal lines on the upper and lower surface diagrams) must be electrically insulated. *1: Ensure that the island sections on the lower surface (as indicated by the diagonal lines on the diagram) do not come into contact with solder from via holes in the board. * When mounting or soldering, take care to ensure that neither static electricity nor electrical overstress is applied to the IC (by taking measures to prevent antistatic, leaks etc.). * When incorporating the device into an item of equipment employ a set design which does not result in voltage being applied directly to the island section.
(2)
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TA2152FLG
Package Dimensions
Weight: 0.05 g (typ.)
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TA2152FLG
RESTRICTIONS ON PRODUCT USE
* The information contained herein is subject to change without notice. 021023_D
060116EBA
* TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc. 021023_A * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. 021023_B * The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. 021023_C * The products described in this document are subject to the foreign exchange and foreign trade laws. 021023_E
About solderability, following conditions were confirmed * Solderability (1) Use of Sn-37Pb solder Bath * solder bath temperature = 230C * dipping time = 5 seconds * the number of times = once * use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath * solder bath temperature = 245C * dipping time = 5 seconds * the number of times = once * use of R-type flux
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